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SMT Electronics Assembly Line
SMT 电子组装线
End-to-end SMT: paste printing, placement, reflow and AOI, with MES traceability and poka-yoke for high-mix mid-volume.
- Placement 25k–60k CPH
- SPI + AOI defect prevention
- Line changeover <20 min
- MES traceability per board
## Line stages
Paste printing → SPI → high-speed / flexible placement → reflow → AOI → depanel
## Where yield comes from
Most SMT defects originate at printing (~60%), not placement. So we put SPI right after printing to stop bad paste on the spot, rather than catching it at post-reflow AOI where rework costs several times more.
## Changeover is the flexibility lever
The pain in mid-volume is changeover. With pre-staged stencils, offline programming and pre-loaded feeders, changeover compresses to under 20 minutes. Without that, high-mix is a nightmare and utilization stays low.
## Honest capacity note
Vendor CPH (placements/hour) is a peak under ideal components and layout. Real mixed boards typically reach 60–75% of the rated figure. We quote against realistic mixed-board rates, not the peak.
Named references available on request.
## Technical Specifications
| Item | Range |
|---|---|
| Placement | 40,000-250,000 CPH per line |
| Components | 01005 to 55 mm connectors |
| Soldering | 8-12 zone reflow, N2 option; selective/wave for THT |
| Inspection | SPI + AOI (3D) + optional AXI |
| Traceability | Panel-level MES with feeder verification |
## Typical Line Configuration
Loader, solder paste printer + SPI, pick-and-place machines, reflow oven, 3D AOI, unloader, MES with feeder setup verification.
## Case Study
An EMS startup in Penang reached 92% first-pass yield in month one on a LUNA-integrated line with full SPI/AOI closed loop.
## FAQ
**Q: What line capacity should a startup EMS begin with?**
A: A single line around 60,000 CPH with one high-speed and one flexible mounter covers most NPI-to-mid-volume needs and scales by adding mounters.
**Q: Is nitrogen reflow necessary?**
A: For lead-free fine-pitch (<0.4 mm) and bottom-terminated components, N2 improves wetting and reduces voiding; otherwise air reflow is adequate.
**Q: How does the closed loop between SPI and printer work?**
A: SPI feeds paste offset data back to the printer, which auto-corrects squeegee/stencil alignment, keeping print CpK above 1.33.
